BZV55C18
vs
BZV55C18
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
CONTINENTAL DEVICE INDIA LTD
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
MELF-2
|
HERMETIC SEALED, GLASS, LEADLESS, LL34, MELF-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.50
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
45 Ω
|
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| Knee Impedance-Max |
225 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
-65 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Reference Standard |
IATF 16949
|
|
| Reference Voltage-Nom |
17.95 V
|
18 V
|
| Reverse Current-Max |
0.05 µA
|
|
| Reverse Test Voltage |
13 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Voltage Tol-Max |
5%
|
6.41%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
3
|
1
|
| Factory Lead Time |
|
14 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| JEDEC-95 Code |
|
DO-213AA
|
|
|
|
Compare BZV55C18 with alternatives
Compare BZV55C18 with alternatives