BZV55C18 vs BZV55C18T3 feature comparison

BZV55C18 STMicroelectronics

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BZV55C18T3 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MOTOROLA INC
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
Dynamic Impedance-Max 45 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e0
Knee Impedance-Max 170 Ω
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -55 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 18 V
Reverse Current-Max 0.1 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND
Terminal Position END
Voltage Temp Coeff-Max 19.8 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 2 1
Part Package Code DO-34
Package Description O-LELF-N2
Pin Count 2
Manufacturer Package Code CASE 362-03

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