BZV55C18
vs
BZV55C18T3
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
MOTOROLA INC
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
|
Dynamic Impedance-Max |
45 Ω
|
|
JESD-30 Code |
O-LELF-R2
|
|
JESD-609 Code |
e0
|
|
Knee Impedance-Max |
170 Ω
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
175 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
GLASS
|
|
Package Shape |
ROUND
|
|
Package Style |
LONG FORM
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
0.5 W
|
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
18 V
|
|
Reverse Current-Max |
0.1 µA
|
|
Surface Mount |
YES
|
|
Technology |
ZENER
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WRAP AROUND
|
|
Terminal Position |
END
|
|
Voltage Temp Coeff-Max |
19.8 mV/°C
|
|
Voltage Tol-Max |
5%
|
|
Working Test Current |
5 mA
|
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
DO-34
|
Package Description |
|
O-LELF-N2
|
Pin Count |
|
2
|
Manufacturer Package Code |
|
CASE 362-03
|
|
|
|
Compare BZV55C18 with alternatives
Compare BZV55C18T3 with alternatives