BZV55C33 vs BZV55-C33 feature comparison

BZV55C33 Microsemi Corporation

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BZV55-C33

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Package Description HERMETIC SEALED, GLASS, SOD-80, LL34, MELF-2
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Samacsys Manufacturer Microsemi Corporation
Additional Feature METALLURGICALLY BONDED
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JEDEC-95 Code DO-213AA
JESD-30 Code O-LELF-R2
JESD-609 Code e0
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 33 V
Surface Mount YES
Technology ZENER
Terminal Finish TIN LEAD
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 6.06%
Working Test Current 2 mA
Base Number Matches 2

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