BZV55C3V3T2 vs BZV55C3V3-T1 feature comparison

BZV55C3V3T2 Motorola Mobility LLC

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BZV55C3V3-T1 Sangdest Microelectronics (Nanjing) Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC SANGDEST MICROELECTRONICS (NANJING) CO LTD
Part Package Code DO-34
Package Description O-LELF-N2 O-LELF-R2
Pin Count 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-N2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 6.06% 6.06%
Working Test Current 5 mA 5 mA
Base Number Matches 2 2
Rohs Code No
Moisture Sensitivity Level 1

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