BZV55C3V6 vs BZV55-C3V6112 feature comparison

BZV55C3V6 Motorola Mobility LLC

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BZV55-C3V6112 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DO-34
Package Description O-LELF-N2 O-LELF-R2
Pin Count 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 90 Ω
JESD-30 Code O-LELF-N2 O-LELF-R2
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish TIN LEAD
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5.56% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 5 1
Operating Temperature-Min -65 °C
Reverse Current-Max 5 µA
Voltage Temp Coeff-Max

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