BZV55F27TRL vs BZV55-B27135 feature comparison

BZV55F27TRL YAGEO Corporation

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BZV55-B27135 NXP Semiconductors

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description O-LELF-R2 O-LELF-R2
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.4 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 27 V 27 V
Reverse Current-Max 0.05 µA 0.05 µA
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Voltage Temp Coeff-Max 25.3 mV/°C 25.3 mV/°C
Voltage Tol-Max 3% 2%
Working Test Current 2 mA 2 mA
Base Number Matches 2 1
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level NOT SPECIFIED
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 40

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Compare BZV55-B27135 with alternatives