BZV80TRL13
vs
1N821AE3
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
PHILIPS COMPONENTS
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
O-LELF-R2
|
HERMETIC SEALED, GLASS, DO-7, 2 PIN
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
O-LELF-R2
|
O-LALF-W2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
6.2 V
|
6.2 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
WRAP AROUND
|
WIRE
|
Terminal Position |
END
|
AXIAL
|
Voltage Temp Coeff-Max |
0.62 mV/°C
|
0.62 mV/°C
|
Working Test Current |
7.5 mA
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
Yes
|
Factory Lead Time |
|
26 Weeks
|
Additional Feature |
|
METALLURGICALLY BONDED
|
JEDEC-95 Code |
|
DO-204AA
|
JESD-609 Code |
|
e3
|
Power Dissipation-Max |
|
0.5 W
|
Terminal Finish |
|
TIN
|
Voltage Tol-Max |
|
4.84%
|
|
|
|
Compare BZV80TRL13 with alternatives
Compare 1N821AE3 with alternatives