BZV85-C24,133 vs MSP1N4749AGE3 feature comparison

BZV85-C24,133 NXP Semiconductors

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MSP1N4749AGE3 Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICROSEMI CORP
Part Package Code DO-4 DO-204
Package Description ROHS COMPLIANT, HERMETIC SEALED, GLASS PACKAGE-2 O-LALF-W2
Pin Count 2 2
Manufacturer Package Code SOD66
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 30 Ω
JEDEC-95 Code DO-41 DO-204AL
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1 W 1 W
Reference Voltage-Nom 24 V 24 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) 30
Voltage Tol-Max 5% 5%
Working Test Current 10 mA 10.5 mA
Base Number Matches 2 1
Operating Temperature-Min -65 °C
Qualification Status Not Qualified

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