BZX384-C2V4,115
vs
JAN1N4371CUR-1
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
DEFENSE LOGISTICS AGENCY
|
Part Package Code |
SOD
|
|
Package Description |
PLASTIC, SMD, SC-76, 2 PIN
|
MELF-2
|
Pin Count |
2
|
|
Manufacturer Package Code |
SOD323
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
600 Ω
|
|
JESD-30 Code |
R-PDSO-G2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.3 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Qualified
|
Reference Voltage-Nom |
2.4 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Voltage Tol-Max |
5%
|
2%
|
Working Test Current |
5 mA
|
20 mA
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-213AA
|
Reference Standard |
|
MIL-19500
|
|
|
|
Compare BZX384-C2V4,115 with alternatives
-
BZX384-C2V4,115 vs BZX384-C2V4
-
BZX384-C2V4,115 vs BZT52H-C2V4,115
-
BZX384-C2V4,115 vs MMSZ5221BST/R7
-
BZX384-C2V4,115 vs JAN1N4371DUR-1
-
BZX384-C2V4,115 vs PDZ2.4BT/R
-
BZX384-C2V4,115 vs JANTXV1N4371CUR-1
-
BZX384-C2V4,115 vs 1N4371A-1
-
BZX384-C2V4,115 vs JANTXV1N4370AUR-1
-
BZX384-C2V4,115 vs MMSZ5221BST/R13
Compare JAN1N4371CUR-1 with alternatives