BZX79-C6V8,113 vs BZX79C6V8-TP feature comparison

BZX79-C6V8,113 NXP Semiconductors

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BZX79C6V8-TP Micro Commercial Components

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Part Package Code AXIAL DO-35
Package Description HERMETIC SEALED, GLASS, SC-40, 2 PIN O-LALF-W2
Pin Count 2 2
Manufacturer Package Code SOD27
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 15 Ω 15 Ω
JEDEC-95 Code DO-35 DO-35
JESD-30 Code O-LALF-W2 O-LALF-W2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) 260 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Standard CECC50005-005
Reference Voltage-Nom 6.8 V 6.8 V
Reverse Current-Max 2 µA 0.002 µA
Surface Mount NO NO
Technology ZENER ZENER
Terminal Finish TIN MATTE TIN
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Time@Peak Reflow Temperature-Max (s) 30 10
Voltage Temp Coeff-Max 4.5 mV/°C
Voltage Tol-Max 5% 5.88%
Working Test Current 5 mA 5 mA
Base Number Matches 2 1
Pbfree Code Yes
Additional Feature METALLURGICAL BONDED
Forward Voltage-Max (VF) 0.9 V
Knee Impedance-Max 80 Ω
Reverse Test Voltage 3 V

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