BZX79C13-AP
vs
BZX79-C13,133
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DO-35
|
AXIAL
|
| Package Description |
O-LALF-W2
|
HERMETIC SEALED, GLASS, SC-40, 2 PIN
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Additional Feature |
METALLURGICAL BONDED
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
30 Ω
|
30 Ω
|
| Forward Voltage-Max (VF) |
0.9 V
|
|
| JEDEC-95 Code |
DO-35
|
DO-35
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e3
|
e3
|
| Knee Impedance-Max |
170 Ω
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
200 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
13 V
|
13 V
|
| Reverse Current-Max |
0.05 µA
|
0.1 µA
|
| Reverse Test Voltage |
10 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
30
|
| Voltage Tol-Max |
6.42%
|
5%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
1
|
2
|
| Manufacturer Package Code |
|
SOD27
|
| Factory Lead Time |
|
4 Weeks
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
CECC50005-005
|
| Voltage Temp Coeff-Max |
|
11 mV/°C
|
|
|
|
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