BZX79C30
vs
BZX79C30-AP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
MICRO COMMERCIAL COMPONENTS
|
| Reach Compliance Code |
compliant
|
unknown
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
80 Ω
|
80 Ω
|
| JEDEC-95 Code |
DO-35
|
DO-35
|
| JESD-30 Code |
O-LALF-W2
|
O-LALF-W2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
300 Ω
|
300 Ω
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
175 °C
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.5 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
30 V
|
30 V
|
| Reverse Current-Max |
0.05 µA
|
0.05 µA
|
| Surface Mount |
NO
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
| Terminal Form |
WIRE
|
WIRE
|
| Terminal Position |
AXIAL
|
AXIAL
|
| Voltage Temp Coeff-Max |
29.4 mV/°C
|
|
| Voltage Tol-Max |
5%
|
6.67%
|
| Working Test Current |
2 mA
|
2 mA
|
| Base Number Matches |
23
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-35
|
| Package Description |
|
O-LALF-W2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Additional Feature |
|
METALLURGICAL BONDED
|
| Forward Voltage-Max (VF) |
|
0.9 V
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Reverse Test Voltage |
|
22 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
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