BZX84-C9V1,235
vs
BZX84C9V1TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
| Part Package Code |
TO-236
|
|
| Package Description |
PLASTIC, SMD, 3 PIN
|
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT23
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Factory Lead Time |
4 Weeks
|
|
| Configuration |
SINGLE
|
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
15 Ω
|
|
| JEDEC-95 Code |
TO-236AB
|
|
| JESD-30 Code |
R-PDSO-G3
|
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
|
| Number of Terminals |
3
|
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
SMALL OUTLINE
|
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Polarity |
UNIDIRECTIONAL
|
|
| Power Dissipation-Max |
0.25 W
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
9.1 V
|
|
| Reverse Current-Max |
0.5 µA
|
|
| Surface Mount |
YES
|
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Voltage Temp Coeff-Max |
7 mV/°C
|
|
| Voltage Tol-Max |
5%
|
|
| Working Test Current |
5 mA
|
|
| Base Number Matches |
2
|
3
|
| Date Of Intro |
|
2019-04-04
|
|
|
|
Compare BZX84-C9V1,235 with alternatives
-
BZX84-C9V1,235 vs BZX84C9V1LT3
-
BZX84-C9V1,235 vs BZX84C9V1
-
BZX84-C9V1,235 vs BZX84C9V1D87Z
-
BZX84-C9V1,235 vs BZX84-C9V1,215
-
BZX84-C9V1,235 vs BZX84-C9V1
-
BZX84-C9V1,235 vs BZX84C9V1TC
-
BZX84-C9V1,235 vs BZX84-B9V1,215
-
BZX84-C9V1,235 vs BZX84C9V1TA
-
BZX84-C9V1,235 vs BZX84C9V1LT1