CBT16211DGG,118 vs IDT74FST163211PA8 feature comparison

CBT16211DGG,118 NXP Semiconductors

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IDT74FST163211PA8 Integrated Device Technology Inc

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP56,.3,20 TSSOP, TSSOP56,.3,20
Pin Count 56 56
Manufacturer Package Code SOT364-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family CBT/FST/QS/5C/B CBT/FST/QS/5C/B
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e4 e0
Length 14 mm 14 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 12 12
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 56 56
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP56,.3,20 TSSOP56,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 0.25 ns 0.25 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 20
Width 6.1 mm 6.1 mm
Base Number Matches 1 1
Additional Feature TTL COMPATIBLE BUS SWITCH
Load Capacitance (CL) 50 pF

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