CC1050PWR
vs
HMC830LP6GE
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP24,.25
|
HVQCCN,
|
| Pin Count |
24
|
40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.G
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Analog Devices
|
| JESD-30 Code |
R-PDSO-G24
|
S-PQCC-N40
|
| JESD-609 Code |
e4
|
e3
|
| Length |
7.8 mm
|
6 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
40
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP24,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
0.9 mm
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
4.4 mm
|
6 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
HCP-40-1
|
|
|
|
Compare CC1050PWR with alternatives
Compare HMC830LP6GE with alternatives