CC2511F32RSPR
vs
ADF7901BRUZ
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
CHIPCON AS
|
ROCHESTER ELECTRONICS INC
|
| Reach Compliance Code |
unknown
|
unknown
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Package Description |
|
TSSOP,
|
| Pin Count |
|
24
|
| JESD-30 Code |
|
R-PDSO-G24
|
| JESD-609 Code |
|
e3
|
| Length |
|
7.8 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
24
|
| Operating Temperature-Max |
|
50 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
COMMERCIAL
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Telecom IC Type |
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
4.4 mm
|
|
|
|
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