CC2511F32RSPR
vs
CC2511F16RSPRG3
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CHIPCON AS
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Package Description |
|
HVQCCN, LCC36,.25SQ,20
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-30 Code |
|
S-PQCC-N36
|
| JESD-609 Code |
|
e4
|
| Length |
|
6 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
36
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC36,.25SQ,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.9 mm
|
| Supply Voltage-Nom |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Telecom IC Type |
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
6 mm
|
|
|
|
Compare CC2511F16RSPRG3 with alternatives