CC3200MODR1M2AMOBR
vs
CC3200MODR1M2AMOB
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
QFM-63
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
|
HTS Code |
8473.30.11.80
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Has ADC |
YES
|
|
Bus Compatibility |
I2C; SPI; UART
|
|
DAC Channels |
NO
|
|
DMA Channels |
NO
|
|
External Data Bus Width |
|
|
JESD-30 Code |
R-XBCC-B63
|
|
JESD-609 Code |
e4
|
|
Length |
20.5 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
25
|
|
Number of Terminals |
63
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
-20 °C
|
|
PWM Channels |
NO
|
|
Package Body Material |
UNSPECIFIED
|
|
Package Code |
BCC
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
CHIP CARRIER
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
2.45 mm
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
2.3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Finish |
NICKEL GOLD
|
|
Terminal Form |
BUTT
|
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17.5 mm
|
|
uPs/uCs/Peripheral ICs Type |
RFSoC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
3
|
|
|
|