CD4050BD3
vs
CD4050BMW/883
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP-16
|
DFP, DIP16,.3
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
CMOS-TTL LEVEL TRANSLATOR
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-CDIP-T16
|
R-GDFP-F16
|
JESD-609 Code |
e0
|
e0
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUFFER
|
BUFFER
|
Max I(ol) |
0.0018 A
|
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DFP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
FLATPACK
|
Prop. Delay@Nom-Sup |
140 ns
|
170 ns
|
Propagation Delay (tpd) |
140 ns
|
155 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
Supply Voltage-Max (Vsup) |
18 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
FLAT
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
3
|
Length |
|
9.6645 mm
|
Moisture Sensitivity Level |
|
1
|
Seated Height-Max |
|
2.032 mm
|
Width |
|
6.604 mm
|
|
|
|
Compare CD4050BD3 with alternatives
Compare CD4050BMW/883 with alternatives