CD4052BFMS
vs
CD4053BE
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
Package Description |
DIP,
|
DIP-16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-GDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom (Vsup) |
|
|
Number of Channels |
4
|
1
|
Number of Functions |
1
|
3
|
Number of Terminals |
16
|
16
|
On-state Resistance-Max (Ron) |
1050 Ω
|
240 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-PRF-38535 Class V
|
|
Seated Height-Max |
5.08 mm
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
210 ns
|
|
Switch-on Time-Max |
320 ns
|
720 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
3
|
7
|
Rohs Code |
|
No
|
Package Equivalence Code |
|
DIP16,.3
|
Signal Current-Max |
|
0.01 A
|
Supply Current-Max (Isup) |
|
0.6 mA
|
Switching |
|
BREAK-BEFORE-MAKE
|
|
|
|
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