CD4370AE3
vs
CD5221B
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Package Description |
S-XXUC-N2
|
DIE-1
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
CATHODE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
JESD-30 Code |
S-XXUC-N2
|
S-XUUC-N1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
1
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Reference Voltage-Nom |
2.4 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UNSPECIFIED
|
UPPER
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
20 mA
|
20 mA
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Dynamic Impedance-Max |
|
30 Ω
|
Knee Impedance-Max |
|
1200 Ω
|
Operating Temperature-Max |
|
175 °C
|
Operating Temperature-Min |
|
-65 °C
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Reverse Current-Max |
|
100 µA
|
Reverse Test Voltage |
|
1 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare CD4370AE3 with alternatives
Compare CD5221B with alternatives