CD54HC00F3A vs SN54HC00J feature comparison

CD54HC00F3A Harris Semiconductor

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SN54HC00J Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer HARRIS SEMICONDUCTOR ROCHESTER ELECTRONICS LLC
Package Description DIP-14 HERMETIC SEALED, CERAMIC, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T14 R-GDIP-T14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.00002 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level 38535Q/M;38534H;883B
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code No
Part Package Code DIP
Pin Count 14
Additional Feature LG-MAX
Length 19.94 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 135 ns
Seated Height-Max 5.08 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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