CD54HCT4067F3A
vs
74HC4067D
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
PHILIPS SEMICONDUCTORS
|
Package Description |
DIP, DIP24,.6
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-GDIP-T24
|
R-PDSO-G24
|
JESD-609 Code |
e0
|
|
Number of Channels |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
On-state Resistance-Max (Ron) |
270 Ω
|
225 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP24,.6
|
SOP24,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Signal Current-Max |
0.025 A
|
0.025 A
|
Supply Current-Max (Isup) |
0.16 mA
|
0.16 mA
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
YES
|
Switch-on Time-Max |
60 ns
|
300 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare CD54HCT4067F3A with alternatives