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CD74HC00EE4 vs 74HC00DB feature comparison

CD74HC00EE4 Texas Instruments

Buy Now Datasheet

74HC00DB Philips Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP-14 SSOP, SSOP14,.3
Pin Count 14
HTS Code 8542.39.00.01
Base Number Matches 1 3
JESD-30 Code R-PDSO-G14
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Max I(ol) 0.004 A
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Terminal Position DUAL

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