Findchips: Compare CD74HC00M96 vs 74HCT132N,652

CD74HC00M96 vs 74HCT132N,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	INTERSIL CORP	NXP SEMICONDUCTORS
Package Description	PLASTIC, SOP-14	DIP, DIP14,.3
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HCT
JESD-30 Code	R-PDSO-G14	R-PDIP-T14
JESD-609 Code	e0	e4
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A	0.004 A
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	DIP
Package Equivalence Code	SOP14,.25	DIP14,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	IN-LINE
Packing Method	TR	BULK
Prop. Delay@Nom-Sup	27 ns	41 ns
Propagation Delay (tpd)	115 ns	50 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO	YES
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	4.5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	AUTOMOTIVE
Terminal Finish	Tin/Lead (Sn/Pb)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	1.27 mm	2.54 mm
Terminal Position	DUAL	DUAL
Base Number Matches	3	1
Part Package Code		DIP
Pin Count		14
Manufacturer Package Code		SOT27-1
Samacsys Manufacturer		NXP
Length		19.025 mm
Peak Reflow Temperature (Cel)		260
Seated Height-Max		4.2 mm
Time@Peak Reflow Temperature-Max (s)		30
Width		7.62 mm
	Logic » Gates	Logic » Gates