CD74HCT02E vs 74HCT02DB-T feature comparison

CD74HCT02E Rochester Electronics LLC

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74HCT02DB-T NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Package Description DIP-14 SSOP, SSOP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T14 R-PDSO-G14
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Propagation Delay (tpd) 26 ns 29 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 7 1
Rohs Code Yes
Part Package Code SSOP
Pin Count 14
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.00002 A
Moisture Sensitivity Level 1
Package Equivalence Code SSOP14,.3
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 29 ns
Schmitt Trigger NO
Seated Height-Max 2 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm

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