CD74HCT4067M96
vs
HEF4067BPB
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP24,.4
|
DIP,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDIP-T24
|
| Length |
15.4 mm
|
31.7 mm
|
| Number of Channels |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Off-state Isolation-Nom |
75 dB
|
50 dB
|
| On-state Resistance Match-Nom |
10 Ω
|
5 Ω
|
| On-state Resistance-Max (Ron) |
180 Ω
|
175 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP24,.4
|
DIP24,.6
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
5.1 mm
|
| Signal Current-Max |
0.025 A
|
|
| Supply Current-Max (Isup) |
0.16 mA
|
0.6 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
58 ns
|
340 ns
|
| Switch-on Time-Max |
60 ns
|
100 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
15.24 mm
|
| Base Number Matches |
1
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
|
|
|
Compare CD74HCT4067M96 with alternatives
Compare HEF4067BPB with alternatives