CDLL5225B
vs
TZM5225B-GS18
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
COMPENSATED DEVICES INC
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Package Description |
HERMETIC SEALED, GLASS, LL34, MELF-2
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-213AA
|
|
| JESD-30 Code |
O-LELF-R2
|
|
| JESD-609 Code |
e0
|
e0
|
| Knee Impedance-Max |
1600 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
175 °C
|
175 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
GLASS
|
|
| Package Shape |
ROUND
|
|
| Package Style |
LONG FORM
|
|
| Polarity |
UNIDIRECTIONAL
|
|
| Qualification Status |
Not Qualified
|
|
| Reference Voltage-Nom |
3 V
|
3 V
|
| Reverse Current-Max |
50 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
WRAP AROUND
|
|
| Terminal Position |
END
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
20 mA
|
20 mA
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Dynamic Impedance-Max |
|
29 Ω
|
| Power Dissipation-Max |
|
0.5 W
|
|
|
|