CDR32BP330BJWMAP vs CDR32BP330BJMSAP feature comparison

CDR32BP330BJWMAP Vishay Intertechnologies

Buy Now Datasheet

CDR32BP330BJMSAP Vishay Intertechnologies

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC VISHAY INTERTECHNOLOGY INC
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20 8532.24.00.20
Factory Lead Time 22 Weeks
Capacitance 0.000033 µF 0.000033 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.3 mm 1.3 mm
JESD-609 Code e0 e4
Length 3.2 mm 3.2 mm
Manufacturer Series CDR
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 5% 5%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Packing Method TR, PUNCHED PAPER, 11.25/13 INCH TR, PUNCHED PAPER, 11 1/4 INCH
Positive Tolerance 5% 5%
Rated (DC) Voltage (URdc) 100 V 100 V
Reference Standard MIL-PRF-55681/8 MIL-PRF-55681
Size Code 1206 1206
Surface Mount YES YES
Temperature Characteristics Code BP BP
Temperature Coefficient 30ppm/Cel ppm/°C 30ppm/Cel ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Silver/Palladium (Ag/Pd)
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.6 mm 1.6 mm
Base Number Matches 2 2

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Compare CDR32BP330BJMSAP with alternatives