CH3038B-37
vs
2EZ56D5-AP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Package Description |
R-XUUC-N1
|
O-PALF-W2
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
R-XUUC-N1
|
O-PALF-W2
|
| JESD-609 Code |
e0
|
e3
|
| Knee Impedance-Max |
2000 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
1
|
2
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
ROUND
|
| Package Style |
UNCASED CHIP
|
LONG FORM
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1 W
|
2 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
56 V
|
56 V
|
| Reverse Current-Max |
10 µA
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
AXIAL
|
| Voltage Temp Coeff-Max |
50.4 mV/°C
|
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
4.5 mA
|
9 mA
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-41
|
| Pin Count |
|
2
|
| Case Connection |
|
ISOLATED
|
| JEDEC-95 Code |
|
DO-41
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare CH3038B-37 with alternatives
Compare 2EZ56D5-AP with alternatives