CHP2010L56R0JN
vs
CHP2010L56R0JBT
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY INTERTECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
30 Weeks
|
30 Weeks
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e2
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
5.03 mm
|
5.03 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.64 mm
|
2.64 mm
|
| Packing Method |
Waffle Pack
|
TR, PLASTIC
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Reference Standard |
MIL-R-55342D
|
|
| Resistance |
56 Ω
|
56 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
TIN SILVER OVER NICKEL
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Tolerance |
5%
|
5%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
5
|
1
|
| Package Description |
|
CHIP
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare CHP2010L56R0JN with alternatives
Compare CHP2010L56R0JBT with alternatives