CLC115MDC vs MAX405ESA+ feature comparison

CLC115MDC National Semiconductor Corporation

Buy Now Datasheet

MAX405ESA+ Maxim Integrated Products

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP MAXIM INTEGRATED PRODUCTS INC
Part Package Code WAFER SOIC
Package Description DIE, SOP, SOP8,.25
Pin Count 11 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 20 µA 4 µA
Bandwidth (3dB)-Nom 700 MHz 180 MHz
Input Offset Voltage-Max 9000 µV 8000 µV
JESD-30 Code R-XUUC-N11 R-PDSO-G8
Neg Supply Voltage Limit-Max -7 V -6 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 1
Number of Terminals 11 8
Output Current-Min 0.048 A 0.06 A
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Slew Rate-Nom 2700 V/us 650 V/us
Supply Voltage Limit-Max 7 V 6 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 2 1
Rohs Code Yes
Bias Current-Max (IIB) @25C 0.002 µA
JESD-609 Code e3
Length 4.9 mm
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Equivalence Code SOP8,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Slew Rate-Min 350 V/us
Supply Current-Max 43 mA
Technology BIPOLAR
Temperature Grade INDUSTRIAL
Terminal Finish Matte Tin (Sn)
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare CLC115MDC with alternatives

Compare MAX405ESA+ with alternatives