CLC410AJ-QML
vs
HFA1100MJ/883
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS LLC
|
| Package Description |
DIP, DIP8,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
CURRENT-FEEDBACK
|
|
| Bias Current-Max (IIB) @25C |
20 µA
|
|
| Common-mode Reject Ratio-Nom |
45 dB
|
46 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
9000 µV
|
10000 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-GDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Min |
430 V/us
|
|
| Supply Current-Max |
18 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Wideband |
YES
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
8
|
| Slew Rate-Nom |
|
2300 V/us
|
|
|
|
Compare CLC410AJ-QML with alternatives
Compare HFA1100MJ/883 with alternatives