CLC410AJ-QML
vs
OPA658U/2K5
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
BURR-BROWN CORP
|
| Package Description |
DIP, DIP8,.3
|
SOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
CURRENT-FEEDBACK
|
|
| Bias Current-Max (IIB) @25C |
20 µA
|
|
| Common-mode Reject Ratio-Nom |
45 dB
|
50 dB
|
| Frequency Compensation |
YES
|
|
| Input Offset Voltage-Max |
9000 µV
|
5500 µV
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Low-Offset |
NO
|
|
| Neg Supply Voltage Limit-Max |
-7 V
|
-5.5 V
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Slew Rate-Min |
430 V/us
|
|
| Supply Current-Max |
18 mA
|
|
| Supply Voltage Limit-Max |
7 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Wideband |
YES
|
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Length |
|
4.9 mm
|
| Slew Rate-Nom |
|
1700 V/us
|
| Unity Gain BW-Nom |
|
900000
|
|
|
|
Compare CLC410AJ-QML with alternatives
Compare OPA658U/2K5 with alternatives