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CLVC1G175MYZPREP vs 74LVC1G79GW,165 feature comparison

CLVC1G175MYZPREP Texas Instruments

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74LVC1G79GW,165 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NXP SEMICONDUCTORS
Part Package Code BGA TSSOP
Package Description VFBGA, BGA6,2X3,20 TSSOP, TSSOP5/6,.08
Pin Count 6 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-XBGA-B6 R-PDSO-G5
Length 1.4 mm 2.05 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.024 A 0.024 A
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 6 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA6,2X3,20 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Prop. Delay@Nom-Sup 8 ns 6.5 ns
Propagation Delay (tpd) 16 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 0.9 mm 1.25 mm
fmax-Min 175 MHz 200 MHz
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code SOT353-1
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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Compare 74LVC1G79GW,165 with alternatives