CMDZ18
vs
PZU18BL
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
CENTRAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Package Description |
R-PDSO-G2
|
1 X 0.60 MM, 0.50 MM HEIGHT, LEADLESS, ULTRA SMALL, PLASTIC, SMD, 2 PIN
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
225 Ω
|
20 Ω
|
JESD-30 Code |
R-PDSO-G2
|
R-PBCC-N2
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-65 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.25 W
|
0.25 W
|
Reference Voltage-Nom |
18 V
|
18 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Position |
DUAL
|
BOTTOM
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
20
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
2
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare CMDZ18 with alternatives
Compare PZU18BL with alternatives