CMX813P3 vs CMX813E4 feature comparison

CMX813P3 CML Microcircuits Plc

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CMX813E4 Mx Com Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CML MICROCIRCUITS LTD MX COM INC
Part Package Code DIP TSSOP
Package Description DIP, DIP16,.3 TSSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.685 mm 5 mm
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.2 mm
Supply Current-Max 2 mA 2 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Telecom IC Type PAGING DECODER PAGING DECODER
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 2 2

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