CMX813P3
vs
CXA1474AN
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MX COM INC
|
SONY CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP,
|
LSSOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Length |
19.685 mm
|
5 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
LSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.45 mm
|
| Supply Current-Max |
2 mA
|
0.93 mA
|
| Supply Voltage-Nom |
5 V
|
1.5 V
|
| Surface Mount |
NO
|
YES
|
| Telecom IC Type |
PAGING DECODER
|
PAGING RECEIVER
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL EXTENDED
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
6.375 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e6/e4
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
BIPOLAR
|
| Time@Peak Reflow Temperature-Max (s) |
|
10
|
|
|
|
Compare CMX813P3 with alternatives
Compare CXA1474AN with alternatives