CN2B2TDD1151F
vs
BCN164AB123J7
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
KOA SPEER ELECTRONICS INC
|
BI TECHNOLOGIES CORP
|
| Package Description |
CHIP
|
SMT, 1206
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Element Power Dissipation |
0.125 W
|
0.063 W
|
| First Element Resistance |
1150 Ω
|
12000 Ω
|
| JESD-609 Code |
e0
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Network Type |
ISOLATED
|
ISOLATED
|
| Number of Elements |
1
|
1
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
4
|
8
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
SMT
|
| Packing Method |
TR, PUNCHED PAPER, 10 INCH
|
TR, PAPER, 7 INCH
|
| Rated Temperature |
70 °C
|
70 °C
|
| Resistor Type |
ARRAY/NETWORK RESISTOR
|
ARRAY/NETWORK RESISTOR
|
| Size Code |
1210
|
0612
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
200 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN OVER NICKEL
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
5%
|
| Working Voltage |
200 V
|
50 V
|
| Base Number Matches |
1
|
2
|
| HTS Code |
|
8533.21.00.20
|
| Construction |
|
Rectangular
|
| Operating Temperature-Max |
|
155 °C
|
| Package Height |
|
0.5 mm
|
| Package Length |
|
1.6 mm
|
| Package Width |
|
3.2 mm
|
| Rated Power Dissipation (P) |
|
0.25 W
|
| Reference Standard |
|
AEC-Q200
|
| Resistance |
|
12000 Ω
|
| Second/Last Element Resistance |
|
12000 Ω
|
|
|
|
Compare CN2B2TDD1151F with alternatives
Compare BCN164AB123J7 with alternatives