CNY174W
vs
TLP183(GB-TPR(T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
TOSHIBA CORP
|
| Package Description |
DIP-6
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.49.80.00
|
| Additional Feature |
UL RECOGNIZED
|
UL APPROVED
|
| Coll-Emtr Bkdn Voltage-Min |
70 V
|
80 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Current Transfer Ratio-Min |
160%
|
100%
|
| Current Transfer Ratio-Nom |
160%
|
|
| Dark Current-Max |
50 nA
|
80 nA
|
| Forward Current-Max |
0.1 A
|
0.05 A
|
| Forward Voltage-Max |
1.65 V
|
1.4 V
|
| Isolation Voltage-Max |
5300 V
|
3750 V
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
SURFACE MOUNT
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.05 A
|
0.05 A
|
| Operating Temperature-Max |
100 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Optoelectronic Device Type |
TRANSISTOR OUTPUT OPTOCOUPLER
|
TRANSISTOR OUTPUT OPTOCOUPLER
|
| Power Dissipation-Max |
0.15 W
|
0.15 W
|
| Response Time-Max |
0.00001 s
|
|
| Surface Mount |
NO
|
YES
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Packing Method |
|
TR, EMBOSSED, PLASTIC, 13 INCH
|
|
|
|
Compare CNY174W with alternatives
Compare TLP183(GB-TPR(T with alternatives