CP2103-GM
vs
UPD360-B/6HX
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
SILICON LABORATORIES INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
QFN-28
|
WFBGA-44
|
Pin Count |
28
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Silicon Labs
|
Microchip
|
Additional Feature |
ALSO OPERATES BETWEEN 4.5 TO 5.25 V IN USB BUS POWER
|
|
Address Bus Width |
|
|
Clock Frequency-Max |
48 MHz
|
48 MHz
|
Data Transfer Rate-Max |
12 MBps
|
|
External Data Bus Width |
|
|
JESD-30 Code |
S-XQCC-N28
|
S-PBGA-B44
|
JESD-609 Code |
e3
|
|
Length |
5 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
28
|
44
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
VFBGA
|
Package Equivalence Code |
LCC28,.2SQ,20
|
BGA44,7X7,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
0.8 mm
|
Supply Current-Max |
26 mA
|
|
Supply Voltage-Max |
3.6 V
|
3.47 V
|
Supply Voltage-Min |
3 V
|
3.1 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
5 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
BUS CONTROLLER, UNIVERSAL SERIAL BUS
|
Base Number Matches |
1
|
1
|
Date Of Intro |
|
2017-07-19
|
Bus Compatibility |
|
I2C; USB
|
Screening Level |
|
TS 16949
|
|
|
|
Compare CP2103-GM with alternatives
Compare UPD360-B/6HX with alternatives