CS82C55AZ96 vs ID82C55A feature comparison

CS82C55AZ96 Intersil Corporation

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ID82C55A AMD

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTERSIL CORP ADVANCED MICRO DEVICES INC
Part Package Code LPCC DIP
Package Description PLCC-44 HERMETIC SEALED, CERAMIC, DIP-40
Pin Count 44 40
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 26 Weeks
JESD-30 Code S-PQCC-J44 R-CDIP-T40
JESD-609 Code e3
Length 16.585 mm 52.324 mm
Moisture Sensitivity Level 3
Number of I/O Lines 24 24
Number of Ports 3 3
Number of Terminals 44 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ DIP
Package Equivalence Code LDCC44,.7SQ
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 5.715 mm
Supply Current-Max 8 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 16.585 mm 15.24 mm
uPs/uCs/Peripheral ICs Type PARALLEL IO PORT, GENERAL PURPOSE PARALLEL IO PORT, GENERAL PURPOSE
Base Number Matches 2 7
External Data Bus Width 8

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