CSD17559Q5
vs
EPC2023ENGR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
EFFICIENT POWER CONVERSION CORP
|
Package Description |
SON-8
|
UNCASED CHIP, R-XXUC-X30
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
|
Samacsys Manufacturer |
Texas Instruments
|
|
Additional Feature |
AVALANCHE RATED
|
|
Avalanche Energy Rating (Eas) |
541 mJ
|
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE
|
DS Breakdown Voltage-Min |
30 V
|
30 V
|
Drain Current-Max (ID) |
257 A
|
60 A
|
Drain-source On Resistance-Max |
0.0015 Ω
|
0.0013 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
Feedback Cap-Max (Crss) |
113 pF
|
|
JESD-30 Code |
R-PDSO-N8
|
R-XXUC-X30
|
JESD-609 Code |
e3
|
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
8
|
30
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
96 W
|
|
Pulsed Drain Current-Max (IDM) |
400 A
|
590 A
|
Surface Mount |
YES
|
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
NO LEAD
|
UNSPECIFIED
|
Terminal Position |
DUAL
|
UNSPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
GALLIUM NITRIDE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare CSD17559Q5 with alternatives
Compare EPC2023ENGR with alternatives