CSD25304W1015 vs FDZ191P feature comparison

CSD25304W1015 Texas Instruments

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FDZ191P Fairchild Semiconductor Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer TEXAS INSTRUMENTS INC FAIRCHILD SEMICONDUCTOR CORP
Package Description GRID ARRAY, R-XBGA-B6 0.65 MM HEIGHT, ULTRA THIN, BGA-6
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.21.00.40 8541.29.00.95
Samacsys Manufacturer Texas Instruments
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 20 V 20 V
Drain Current-Max (ID) -3 A 3 A
Drain-source On Resistance-Max 0.092 Ω 0.2 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 15.6 pF
JESD-30 Code R-XBGA-B6 R-PBGA-B6
JESD-609 Code e1 e1
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 6 6
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Polarity/Channel Type P-CHANNEL P-CHANNEL
Power Dissipation Ambient-Max 0.75 W
Power Dissipation-Max (Abs) 0.75 W 1.5 W
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 1
Part Package Code CSP
Pin Count 6
Manufacturer Package Code 6 BALL WLCSP, 2X3 ARRAY, 0.5MM PITCH, 300UM BALL
Qualification Status Not Qualified

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