CXK58257CP-70LL vs CY62256NL-70PXC feature comparison

CXK58257CP-70LL Sony Semiconductor

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CY62256NL-70PXC Rochester Electronics LLC

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SONY CORP ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP28,.6 0.600 INCH, LEAD FREE, MS-011, DIP-28
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-PDIP-T28
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Standby Current-Max 0.000005 A
Standby Voltage-Min 2 V
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 28
JESD-609 Code e3
Length 36.322 mm
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 5.08 mm
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 20
Width 15.24 mm

Compare CXK58257CP-70LL with alternatives

Compare CY62256NL-70PXC with alternatives