CY14E256LA-SZ25XI vs U635H256CD1K25 feature comparison

CY14E256LA-SZ25XI Infineon Technologies AG

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U635H256CD1K25 Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG SIMTEK CORP
Package Description SOIC-32 DIP, DIP28,.6
Reach Compliance Code compliant unknown
Samacsys Manufacturer Infineon
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDIP-T28
JESD-609 Code e3 e0
Length 20.726 mm 37.1 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM NON-VOLATILE SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP32,.4 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.54 mm 5.1 mm
Standby Current-Max 0.008 A 0.003 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.07 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 7.505 mm 15.24 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.41

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