CY22150FZXI
vs
841N4830BKILF/W
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
VFQFPN
|
| Package Description |
TSSOP-16
|
VFQFN-32
|
| Pin Count |
16
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
OPERATES AT 2.5 V MINIMUM SUPPLY AT 150 MHZ
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-XQCC-N32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
16
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Clock Frequency-Max |
166.6 MHz
|
100 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Primary Clock/Crystal Frequency-Nom |
30 MHz
|
25 MHz
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Supply Voltage-Max |
3.465 V
|
3.6 V
|
| Supply Voltage-Min |
3.135 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
4.4 mm
|
5 mm
|
| uPs/uCs/Peripheral ICs Type |
CLOCK GENERATOR, OTHER
|
CLOCK GENERATOR, OTHER
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
NLG32P1
|
|
|
|
Compare CY22150FZXI with alternatives
Compare 841N4830BKILF/W with alternatives