CY62128BNLL-55SXI
vs
HM628128DLFP-5SL
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
0.450 INCH, LEAD FREE, SOIC-32
|
SOP,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
55 ns
|
55 ns
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| JESD-609 Code |
e4
|
|
| Length |
20.4465 mm
|
20.45 mm
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.997 mm
|
3 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
11.303 mm
|
11.3 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
|
|
|
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