CY62157DV30L-55BVI vs W963B6BBN70E feature comparison

CY62157DV30L-55BVI Rochester Electronics LLC

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W963B6BBN70E Winbond Electronics Corp

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC WINBOND ELECTRONICS CORP
Part Package Code BGA BGA
Package Description 6 X 8 MM, 1 MM HEIGHT, FBGA-48 TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code unknown compliant
Access Time-Max 55 ns 65 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Length 8 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 2.2 V 2.3 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 6 mm 6 mm
Base Number Matches 2 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Standby Current-Max 0.00007 A
Supply Current-Max 0.02 mA

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