CY62157DV30LL-55BVXA vs CY62157EV30LL-55BVXE feature comparison

CY62157DV30LL-55BVXA Rochester Electronics LLC

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CY62157EV30LL-55BVXE Cypress Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description VFBGA, VFBGA,
Pin Count 48 48
Reach Compliance Code unknown compliant
Access Time-Max 55 ns 55 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1 e1
Length 8 mm 8 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.2 V 2.2 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 30
Width 6 mm 6 mm
Base Number Matches 2 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41

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